Descum
Used for bump formation in wafer level packaging.
The process that remove scum material selectively without loss of bulk photoresist after developing and assisting flawless electroplating
Description
Used for bump formation in wafer level packaging.
The process that remove scum material selectively without loss of bulk photoresist after developing and assisting flawless electroplating
Brand
Vision Semicon
Visionsemicon was founded in 1997 only to produce and develop semiconductor manufacturing device.
We have been approved by many companies around with high performance devices, such as semiconductor Plasma.
Specification
| Plasma source | ICP & RF bias |
|---|---|
| Wafer size | 200mm / 300mm |
| Wafer transfer | Vacuum transfer using loadLock |
| System dimension (mm) Process chamber |
2750 x 3130 x 1775 |
| Max 3 | |
| Application | Descum (PR, PI, PBO, BCB) |
| Surface modification | |
| Etch (SiO2, Si3N4) | |
| Operating software | Windows 7 |
| FIDES – cluster control software |
Features
Excellent Etching Uniformity : 〈 3%
High Reliable Brooks Platform
Safe & Stable Process by Vacuum Transfer
Low CoC by Optimized Simple Chamber Design
Mold & Glass wafer Process Capability with High performance ESC
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