Model EDB-141 Epoxy / Silver Glass Die Bonder
HYBOND’s Model EDB-141 is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement.
The EDB-141 can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with HYBOND’s micro-dispense head for extremely low volume epoxy dispensing.
This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system.
The EDB-141 is modular and easily adapts to modifications to accommodate fixturing for custom packages.
Description
HYBOND’s Model EDB-141 is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement.
The EDB-141 can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with HYBOND’s micro-dispense head for extremely low volume epoxy dispensing.
This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system.
The EDB-141 is modular and easily adapts to modifications to accommodate fixturing for custom packages.
Brand
Hybond
HYBOND, Inc. designs, manufactures and sells Thermosonic Ball and Wedge WireBonders; Single Point TAB Bonders; Epoxy and Silver-Glass Die Bonders; Eutectic and Laser Diode Die Bonders; DFS Universal Bonder Test Units and a variety of adjustable height heated work stages.
Standard Features
- Color CCTV System (as shown)
- Package depth sensing for consistent and precise bond line thickness
- Built-in programmable dispense control
- Storage for up to 200 dispense programs
- Motorized/programmable X-Y stage
- Waffle pack/loose die pickup pedestal
- Pitch & Roll adjustments for bond head
- Custom die collets to match customer die
- Manual & Semiautomatic operation modes
- Remote control panel for ease of operation
- Programmable dispense patterns
Optional Features
- Die Ejector Systems
- Vacuum die pedestal for jel packs
- Zoom Stereo Microscope w/ Swivel Base
- Dual fiber-optic illumination system
- Stir column for silver glass /conductive epoxy
- Micro-Dispensing head
- Lead frame indexing systems
- Semi-automatic indexing systems
- Heater stage and temperature controller
- Customization based on specific application
Specifications
» Dispense System:
Programmable pressure, time and suck-back (avoids drip) system.
» Bond Line Accuracy:
±.0.5 mil (±m12,7 lµm)
» Temperature Control Range:
Ambient to 250° C with optional heat stage.
» Bondable Die Size Range:
6×6 mils (152×152 µm) to 1×1 inch (25×25 mm) standard
» Placement Accuracy:
± 1 mil (25,4 µm) standard. Less when adding microscope option.
» Dispense Materials:
Epoxy, conductive epoxy and silver glass.
» Bond Head Movement:
Motorized, rotational, w/ fixed pick-up and placement points.
» Bond Actuation:
By opto-sensor at fixed height. Cycle initiated by footswitch.
» Vertical Bonding Window:
0.5 in (1.20 cm) / 0.125 to 0.500 in. (0,31 to 1,20 cm).
» Table Motion:
Motorized/programmable ±.78” (20mm) travel, standard
» Input Power Requirements:
120 VAC 50/60 Hz @ 10 amps. 240VAC requires PN 600-065
» Min. Bench Space Required:
Height/width: 24in. (45cm), Depth: 22in. (56cm), without monitor.
» Facilities Required (min.):
Vacuum: 23in.Hg (584mmHg). Air: 60psi (4,2Kg/cm3).
» Unit Weight /Shipping Weight:
75lbs (34Kg)/150lbs (68Kg). Shipping weight will vary.
» Approx. Units Per Hour (UPH):
90 – 240 depending on options, settings and mode of operation.
Reviews
There are no reviews yet.