Pressure Oven
When bonding during process, it applies pressure and temperature to remove tiny void in adhesive and increases steady stiffness and adhesion by controlling void elimination
Wafer Lamination
Die Bonding TC Bonding
(Thermo compressing bonding)
Dispensing / Printing / Potting
Via Filling
Capillary underfilling / No flow underfilling
Reflow
Description
When bonding during process, it applies pressure and temperature to remove tiny void in adhesive and increases steady stiffness and adhesion by controlling void elimination
Wafer Lamination
Die Bonding TC Bonding
(Thermo compressing bonding)
Dispensing / Printing / Potting
Via Filling
Capillary underfilling / No flow underfilling
Reflow
Brand
Vision Semicon
Visionsemicon was founded in 1997 only to produce and develop semiconductor manufacturing device.
We have been approved by many companies around with high performance devices, such as semiconductor Plasma.
Specification
| Model | VSAO-1CM-750-10 | |
|---|---|---|
| Contol | Chamber Temp. | UP550(30 Pattern, 99Segment) |
| Main Control | IPC | |
| Pressure | Range | Max. 1MPa |
| Uniformity | ±0.01MPa | |
| Ramp up time | ATM-7kg/cm2_less then 5min ATM-10kg/cm2_less then 10min (supply at More than 0.6Mpa) |
|
| Temperature | Range | Amb.+10℃ ~ 220℃ |
| Uniformity | ±3% (at 0.7Mpa) | |
| Ramp up time | Amb. ~ 175℃ Within 30 min | |
| Cooling down time | 175℃ – 80℃ Within 30 min | |
| Heater | 24kw | |
| Required Utilities | Inlet Air | 0.5MPa |
| Inlet N2 | 0.25MPa | |
| Cooling Water | Supply temp. : Within 25℃ | |
| Safety device | Electronic Control over temp. limit 1ea, | |
| Size (W×D×H) | Internal(㎜) | 1 Shelf : 550×180×700 2 Shelf : 550×190×700 |
| External(㎜) | 1620×2270×2030 | |
| Electric requirement | AC220VAC 3P 60Hz | |
Features
Temperature uniformity ±3%
Temperature control accuracy ± 0.1℃
Pressure: Max. 2.0MPa (20 kg/cm^2)
1st and 2nd pressure safety valves
Digital Recording and Network application
Temperature control and Multistep cure by control panel
Parameter management by barcode
LAN network and CIM PIM hard disk data storage
IN/OUT Automatic indication on LCD monitor
Excellent temperature control with superior temperature homogeneity
Easy PC control program
Easy to drive machine and manage data by its own software
Sample protection by overheating prevention system
Door open when power failure
Acquired safety certificate of pressure vessel
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